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ET23SWE0014 - 14th IEA Heat Pump Conference (HPC)

Complete
Project Name
14th IEA Heat Pump Conference (HPC)
Project Number
ET23SWE0014
Funding Entity
SWE
Market Sector
Cross Cutting
Distribution Report
Project Description

The Program Team will attend the “14th IEA Heat Pump Conference” (HPC) in Chicago, IL between May 15-18, 2023. HPC “will serve as a forum to discuss the latest technologies in heat pumps, and exchange valuable knowledge in market, policy, and standards information on related technologies.” Stakeholders attending the forum are “policymakers, efficiency program leaders, utility program administrators, manufacturers, distributors, researchers, and technology supporters.” The purpose of attending this event is to interact with key stakeholders, discover emerging technology (ET) presented, create a call to action for external project submissions, and build awareness of CalNEXT.